Ka inoa Kahuna: Copper oxde (Electroplate Class)
Nā meaʻole .: 12069-69-1
Molecural socula: cuc3 · c (oh (((xh2o
Molela kaumaha: 221.11 (Anydride)
Nā waiwai: aia ia ma kahi'ōmaʻomaʻo'ōmaʻomaʻo. Aʻo ka pono wehewehe maʻalahi; Kaumaha:
3.85; Melting Point: 200 ° C; insol i ka wai anuanu, wai wai; lulu i loko o ka acid,
Kokiki, sodium Hydroxide, Amerima Kaau,
Ke noi: I loko o kaʻoihana paʻakai paʻakai, hoʻohanaʻia no ka hoʻomākaukauʻana o nāʻano likeʻole
ipuku, Ma kaʻoihanaʻoihana, ua hoʻohanaʻia ia e like me ka catalyst o nā mea kūlohelohe
synthesis; I kaʻoihana uila, ua hoʻohanaʻiaʻo ia e like me ka hoʻohuiʻana o ka copper. I kēia manawa
mau makahiki, ua nui loa ia ma ke kahua o ka lāʻau lāʻau.
Nā Parameters Pūnaewele (HG / T4825-2015)
(Cu)% ≥55.0
Choper Caronate%: ≥ 96,.0
(PB)% ≤0.003
(Na)% ≤0.3
(As)% ≤0.005
(Fe)% ≤0.05
Acdid insoluble% ≤ 0.003
Hoʻopili: 25KG Bag